MEMSIC Ultra‑Low‑Power Automotive‑Grade Accelerometer MXC3638AL Wins “2025 Hard‑Core Sensor Chip Award”

Shenzhen, September 11, 2025 — The 7th Hard‑Core Chip Ecosystem Conference & Award Ceremony successfully concluded in Shenzhen. Featuring two parallel forums, the conference focused on cutting‑edge topics across the semiconductor industrial chain. It brought together industry leaders, technical experts and senior scholars from IC vendors, end‑device manufacturers, automotive enterprises, investment institutions and research institutes. In‑depth discussions covered hot themes including home‑grown chip independence and controllability, advanced packaging, edge‑side AI, automotive‑grade chips and the RISC‑V ecosystem, delivering insights to fuel high‑quality development of China’s semiconductor industry.

As the highlight closing segment of the event, winners of the 2025 Hard‑Core Chip Awards were officially announced. Standing out among 128 participating enterprises and 162 submitted products, MEMSIC (Tianjin) Co., Ltd. received the “2025 Hard‑Core Sensor Chip Award” for its outstanding product performance.

1. Award‑Winning Product: MXC3638AL

The MXC3638AL is an automotive‑grade 3‑axis accelerometer built with single‑chip architecture and ultra‑low‑power design. It supports I2C/SPI communication interfaces, delivers 16‑bit high precision, and offers configurable operating modes. Equipped with motion‑detection capability, it outputs interrupt signals to achieve ultra‑low‑power standby and can wake up the MCU via motion‑triggered interrupts. Housed in a 2 × 2 mm LGA package and qualified to AEC‑Q100 Grade 3, it is well‑suited for applications such as automotive smart keys.

This “2025 Hard‑Core Sensor Chip Award” recognizes MEMSIC’s consistent commitment to independent innovation and chip R&D. Going forward, MEMSIC will uphold its innovation‑driven mindset, scale up R&D investment, and continuously improve product performance and quality. The company will deliver higher‑quality sensor solutions for global customers and contribute to the advancement of the broader sensor industry.

2. About MEMSIC (Tianjin) Co., Ltd.

Founded in 1999, MEMSIC boasts over two decades of accumulated expertise in MEMS‑sensor R&D and manufacturing. It operates production and R&D sites across China, Europe and the United States, with a sales network covering Asia‑Pacific, Europe, the Americas and Africa.

As a world‑leading supplier of inertial MEMS sensors, MEMSIC has established comprehensive systems for brand management, channel development and quality assurance. It is one of China’s earliest inertial‑sensor suppliers adopting the IDM model, which underpins its core competitive strengths in testing, packaging and wafer fabrication.

MEMSIC provides one‑stop solutions ranging from MEMS sensing chips and software algorithms to application‑level implementations. Its product portfolio includes thermal accelerometers, capacitive accelerometers, AMR geomagnetic sensors, Hall sensors, eOIS image‑stabilization chips, 6‑axis IMUs and encoders. These products are widely deployed in automotive, industrial, medical, wearable, smart‑home and consumer‑electronics sectors, bringing smarter, more reliable and safer technological experiences to end users worldwide.