AI Empowers Reality, Sensing Fuels Intelligence | MEMSIC Shines at 2026 Wuxi Intelligent Sensor Innovation & Development Conference, Launching Three New Products
Release Time：2026.11.02
On October 31, the 2026 Wuxi Intelligent Sensor Innovation & Development Conference themed “AI Empowers Reality, Sensing Fuels Intelligence” kicked off in Wuxi National Hi-Tech District. Distinguished attendees included Academician Sun Shengli of the Chinese Academy of Sciences, Academician Ding Rongjun of the Chinese Academy of Engineering, Chi Yu, Deputy Director-General of Jiangsu Provincial Department of Industry and Information Technology, alongside a roster of experts, entrepreneurs, university representatives and leaders from supporting institutions across the intelligent sensor sector. Participants gathered to explore cutting-edge trends in intelligent sensing and chart a path for high-quality industrial development amid the era of embodied intelligence. As a flagship intelligent sensor enterprise based in Wuxi National Hi-Tech District, MEMSIC was invited to the event.
Intelligent sensors form the starting point of the ubiquitous perception-advanced communication-autonomous decision-making chain for the Internet of Things, serving as a core foundation for the digital economy, artificial intelligence and embodied intelligence. As the nation’s first National Sensor Network Innovation Demonstration Zone and the birthplace of “Perception China”, Wuxi boasts a fully-fledged domestic industrial cluster for MEMS microfabrication and intelligent sensing. Anchored in its goal of building a “Capital of the Internet of Things”, the city is steadily advancing from ubiquitous connectivity toward ubiquitous intelligent connectivity.
At the conference, MEMSIC, together with 11 other leading intelligent sensor enterprises from Wuxi National Hi-Tech District including Huajing Sensing, Beiwei Sensing and Lingzhang Robotics, unveiled their latest technological innovations, marking remarkable progress from catch-up development toward parallel growth and global leadership. The three newly launched MEMSIC products span MEMS inertial sensing, angle sensing and intelligent driving, linking the full workflow of perception – measurement – actuation.
Among them, the newly released 6-axis IMU chip embodies MEMSIC’s years of deep expertise in inertial sensing. Integrating a 3-axis gyroscope, a 3-axis accelerometer and a dedicated ASIC, the chip adopts a proprietary dual-chamber pressure control design for accelerometer and gyroscope. Developed over five years, the team overcame process hurdles and patent barriers within a shorter development cycle compared with peers. It delivers gyro sensitivity error of only 1%, bias as low as 3 dps and a temperature sensitivity coefficient of 0.02%/°C, with key performance metrics on par with the world’s top-tier 3 suppliers. The chip has passed stringent reliability validation including 60,000 drop tests and 20 kg-level shock tests with zero failures, achieving world-leading mechanical reliability among consumer-grade IMUs. It stands as a pioneer and core workhorse for domestic substitution of IMU chips.
While the IMU enables smart devices to sense orientation and motion, the newly launched high-precision AMR encoder chip targets angle measurement for robotic joints. Built upon years of AMR magnetic sensor know-how and MEMSIC’s in-house AMR wafer fab, the chip helps reduce industry reliance on optical encoders and seizes the major industry shift from optical encoders toward magnetic alternatives. It achieves linear error ≤0.07°, resolution up to 21 bits and a maximum measurable rotational speed of 120,000 RPM, with outstanding anti-interference performance that addresses the primary pain points of optical encoders. Packaged in a compact 3×3 mm QFN form factor, it fits into confined spaces such as robotic dexterous hands. Embedded with on-chip ASIC auto-calibration algorithms, it supports multiple interfaces including SPI, PWM, UVW and ABZ. MEMSIC’s three-temperature calibration capacity will reach 12 million wafers per annum within this year, expected to capture roughly 40% of the addressable market for optical encoder replacement.
Furthermore, MEMSIC has extended its product portfolio into the actuation layer. The MSD4200WA electronic optical image stabilization (eOIS) driver chip represents MEMSIC’s breakthrough beyond sensor development and its foray into intelligent driver ICs. It delivers an OIS suppression ratio of 40 dB, fast and stable PID control, stabilization precision down to 1 μm, output resistance as low as 1.8 Ω and standby current of merely 150 μA. Supporting the I3C interface for high-end platforms, it achieves CIPA stabilization Level 5 and above, reliably handling demanding shooting scenarios such as low-light capture at live concerts. Its specifications match or outperform global first-class counterparts.
Covering inertial sensing, angle measurement and intelligent driving, the three new releases showcase MEMSIC’s cumulative MEMS technology strength and in-house wafer manufacturing capability. The 6-axis IMU spearheads domestic substitution; the high-precision AMR encoder rides the industry transition from optical to magnetic encoding; and the eOIS driver chip marks MEMSIC’s pivotal expansion from sensor chips into intelligent driver ICs. Together, they form a complete perception-measurement-actuation chain, widely applicable to smartphones, wearables, robots and other AIoT terminals. Through continuous technological iteration and product innovation, MEMSIC accelerates its R&D tempo to meet rising demands for perception performance in the AI and embodied intelligence era.
Benefiting from Wuxi’s fertile IoT ecosystem and the cluster advantages of the National Sensor Network Innovation Demonstration Zone, MEMSIC takes this conference as a new starting point to accelerate mass production and commercial rollout of new products. The company will deepen collaborative innovation with upstream and downstream industrial partners, jointly tackle core critical technologies and drive domestic breakthroughs in intelligent sensors. For the era of ubiquitous intelligent connectivity, MEMSIC will remain rooted in Wuxi while serving markets nationwide, injecting continuous chip-level momentum as Wuxi builds a national R&D and manufacturing hub for intelligent sensors and a world-class advanced manufacturing cluster for the Internet of Things.
