Honored at the Grand Event: Excellence Begets Continuity! MEMSIC Shines at China MEMS 2025
Release Time:2025.10.27
October 22 — The 6th China MEMS Manufacturing Conference kicked off amid high anticipation. This premier gathering bringing together over 350 global industry pioneers centers on “New Processes · Robust Packaging · Intelligent Sensing”, comprehensively unpacking innovative breakthroughs and future directions of the MEMS industry.

During the highly‑anticipated “Top 10 Chinese MEMS Enterprises” award ceremony, MEMSIC once again claimed its place among the honorees, building on 26 years of technological accumulation and full‑industrial‑chain strengths. This repeated recognition underscores MEMSIC’s benchmark status as a leading Chinese MEMS player, proven by its solid technical capabilities.
As a world‑leading MEMS sensor supplier, MEMSIC showcased its one‑stop sensing solutions spanning chips, algorithms and application frameworks. Meanwhile, important industry insights were shared at the “Embodied Sensing” special session. Mr. Sam Lu, CEO of MEMSIC, delivered a presentation titled Precise Sensing Enables Superior Intelligence — MEMSIC MEMS Sensors Empower Robotic Applications. He provided an in‑depth analysis of how sensing technologies address the “human‑like perception” challenge for robots, earning warm responses from attendees.

Robust Technology: Building the “Neural Network” for Robots
MEMSIC’s comprehensive product portfolio includes thermal & capacitive accelerometers, high‑precision AMR geomagnetic sensors, image‑stabilization chips, 6‑axis IMUs and magnetic encoders.
Cumulative global shipments of its geomagnetic sensors and accelerometers have each reached billions of units, forming large‑scale application ecosystems across automotive electronics, consumer electronics, industry and medical sectors.
Tailored for core robotic requirements, the newly‑launched AMR magnetic encoder MDA2000BT achieves angular‑measurement accuracy of ±0.07°, representing an order‑of‑magnitude improvement in precision compared with leading international competitors. Featuring low temperature drift and high vibration resistance, it is well‑suited for industrial‑robot joint control and BLDC motor drive scenarios. Capable of replacing optical encoders in selected use‑cases, it delivers substantial system‑level cost reduction.
Full‑Chain Competitive Moat: Meeting Explosive Market Demand
As one of China’s earliest MEMS sensor enterprises adopting the IDM model, MEMSIC has established end‑to‑end production capacity covering both front‑end and back‑end manufacturing. Core links including MEMS chip design, ASIC signal processing and software‑algorithm development are fully domestically controlled. Such vertical integration enables consistent delivery amid global supply‑chain volatility and supports fast innovation in emerging fields.

Driven by a high compound annual growth rate, China’s intelligent‑robot market is advancing toward a trillion‑scale market size. As core components for robot navigation, positioning and attitude control, MEMS sensors are witnessing surging demand.
Supported by its fully self‑reliant AMR supply chain, MEMSIC’s high‑precision AMR magnetic encoders are deployed in sophisticated scenarios such as robot joint control, enabling the “perception‑decision‑actuation” closed‑loop operation for robots within dynamic environments.
“As embodied intelligence reshapes industry competition, MEMS competition is shifting from discrete component performance toward system‑level intelligence and reliability. To seize opportunities in the robotics era, companies must master multi‑sensor fusion, low‑power AI deployment and system‑wide supply‑chain collaboration,” noted Sam Lu, CEO of MEMSIC.

As embodied intelligence continues to evolve, MEMSIC builds on “precise sensing” to drive the transformation of robots from automated tools into intelligent agents with perception and decision‑making capabilities. The company delivers core momentum for high‑end manufacturing upgrading and the development of new‑quality productive forces.