MEMSIC Showcases at the Inaugural Aerospace Science and Technology Expo: Full-Stack MEMS Sensing Empowers Aerospace Innovation and Low-Altitude Economy

From October 13 to 15, the 11th China Aviation Innovation and Entrepreneurship Competition was held at the Nantong International Exhibition Center in Jiangsu. Co-hosted by the Chinese Society of Aeronautics and Astronautics together with AVIC, AECC, COMAC, China Xinhua News Holdings and other organizations, the event ran alongside a series of concurrent activities including the inaugural Aerospace Science and Technology Expo and the 2nd Aerospace Industrial Chain Innovation and Development Conference. Altogether 212 outstanding aerospace tech projects competed on-site, while hundreds of exhibitors displayed their offerings, presenting innovative achievements and industrial vitality across the aerospace sector.

MEMSIC, a global builder of full-stack MEMS sensing technology ecosystems, was invited to the exhibition. On display were its core products including 6-axis IMUs, AMR geomagnetic sensors, AMR magnetic encoders, thermal / capacitive accelerometers, Hall sensors and eOIS image stabilization driver chips. MEMSIC demonstrated its one-stop MEMS sensing capability spanning “sensing chips + software algorithms + application solutions”, empowering aerospace innovation and low-altitude economic development with high-performance Chinese semiconductor devices.

A Decade of Dedication: Fertile Ground for Aerospace Innovation

For ten years, the China Aviation Innovation and Entrepreneurship Competition has stood alongside aerospace innovators, witnessing breakthroughs and supporting the transition of technologies from research exploration to industrial adoption. Now in its 11th year, the competition connects promising technologies with real application scenarios, links high-quality projects to industrial resources, and translates innovation into growth momentum.

From technical competitions and in-depth booth discussions to pragmatic matchmaking between industry and capital, MEMSIC engaged in extensive exchanges with aerospace OEMs, research institutes, industrial partners and investment institutions during the show. Both sides explored viable collaboration opportunities for high-growth tracks such as UAVs, the low-altitude economy and embodied-intelligence robots.

Tailored for Aerospace Scenarios: Full MEMS Sensing Portfolio on Display

Aerospace and low-altitude applications impose stringent requirements on sensors: high precision, high reliability, wide temperature tolerance and strong anti-interference performance. MEMSIC’s showcased product portfolio delivers systematic solutions built for these demanding environments.

For low-altitude flight, the 6-axis IMU integrating a 3-axis gyroscope and 3-axis accelerometer features high precision, low drift, low thermal drift and robust reliability. It supports diverse communication interfaces and interrupt modes, serving as a core component for UAV flight controllers and integrated navigation. MEMSIC’s strong algorithm team also provides customized algorithm support for customers. The AMR 3D geomagnetic sensor, built on anisotropic magnetoresistance technology, achieves 1° measurement resolution with temperature-stable zero bias and low susceptibility to magnetic disturbances. It requires fewer recalibrations after exposure to strong magnetic interference, delivering critical heading data for UAV electronic compasses and heading reference systems. This continues MEMSIC’s pioneering legacy of bringing high-performance AMR magnetic sensors to the consumer market.

For embodied-intelligence robots, the AMR magnetic encoder achieves INL angular accuracy better than ±0.07°. It supports multiple output formats: 21-bit SPI, 12-bit PWM, ABZ (1–16384 PPR) and UVW. Operating in saturation mode, it effectively suppresses vertical magnetic interference and supports up to 65,536 turns counting. It can replace selected optical encoders to meet requirements for absolute joint angle measurement and servo / BLDC motor control in robots.

For high-reliability sensing, MEMSIC’s globally unique thermal accelerometer contains no moving mechanical parts and delivers exceptional robustness. It achieves a 100% pass rate in drop tests, is inherently immune to high-frequency motor vibration, features high stress tolerance and minimal zero-bias shift before and after SMT reflow. It is ideal for UAVs, smart meters and harsh industrial environments. The capacitive accelerometer, backed by 600 million units of mass-production experience, offers ultra-thin form factors and ultra-low power consumption. Hall switch sensors with a typical operating current of only 2.5 μA cater to ultra-long standby applications. The eOIS image stabilization driver chip, packaged in a 0.315 mm ultra-thin WL-CSP, integrates high-precision sensing, H-bridge constant-current drive and hardware PID algorithms, reflecting MEMSIC’s deep expertise in consumer electronics.

MEMSIC’s booth drew many professional visitors. On-site technical specialists discussed performance metrics, scenario adaptation and algorithm support with attendees. Visitors from UAV, robotics, automotive electronics and industrial sectors explored sensor selection and customized solutions based on their application needs. MEMSIC’s one-stop delivery capacity won wide recognition from industrial partners, and multiple potential cooperation opportunities emerged from these conversations.

Over Two Decades of Expertise: From Sensing Hardware to Intelligent Sensing Infrastructure

With more than 20 years of continuous investment, MEMSIC is a global inertial MEMS supplier with end-to-end capabilities covering chip design, wafer fabrication, packaging and testing. It provides one-stop delivery including sensing chips, software algorithms and application solutions. The company holds the national-level “Specialized, Refined, Differential and Innovative Little Giant Enterprise” accreditation and has been listed among China’s Top 10 MEMS Enterprises for many consecutive years. Its products are widely deployed in consumer electronics, automotive, IoT, low-altitude economy, embodied-intelligence robots, aerospace and industrial markets.

Amid the AI and new-energy revolution, MEMSIC is evolving from a “sensing hardware supplier” into an “intelligent sensing infrastructure provider”, enabling seamless connectivity between the physical and digital worlds. Looking ahead, MEMSIC will keep increasing R&D investment and partnering with aerospace industry players. Together, the company and its allies will turn innovations from competition demos into industrial products and from prototypes into mass production, injecting powerful semiconductor momentum into the high-quality development of the low-altitude economy and aerospace technology.