Forging New Paths Together | MEMSIC Chairperson Huang Haiyan Visits WHOOP and Gentex to Expand Smart Sensing Collaboration

During the visit, Huang Haiyan, Chairperson of MEMSIC, led a team on a business trip to the United States, visiting wearable tech firm WHOOP and automotive electronics specialist Gentex in sequence. The two sides held in-depth discussions on ongoing collaboration, product roadmaps and future application requirements. Spanning health monitoring, smart wearables and automotive electronics, this visit served both to review and deepen existing partnerships, while unlocking new application opportunities for MEMSIC’s ultra-low-power accelerometers, IMUs, high-precision geomagnetic sensors, magnetic encoders and Hall sensors.

From low-power sensing in wearables to position and angle detection for automotive electronics, the intelligent evolution of end devices keeps expanding the application boundaries of sensors. In response to shifting market demands, MEMSIC stays close to customers and listens to on-site feedback. Through product evaluation, technical reviews and joint brainstorming, the company aligns R&D more closely with real-world application scenarios.

Growing Side by Side: Exploring New Wearable Opportunities with WHOOP

Huang Haiyan and her team first visited WHOOP’s office in Boston, where WHOOP shared its latest progress in health-tracking wearables. As its products gain traction in the mass fitness market and add health monitoring functions such as blood pressure measurement, shipments are rising rapidly.

MEMSIC and WHOOP have maintained a three-year partnership. As WHOOP’s business expands, the scope of collaboration has grown steadily. MEMSIC’s ultra-low-power, ultra-thin accelerometers are integrated into WHOOP smart wearables, supporting hardware double-tap wakeup under always-on low-power operation. To meet surging customer demand, MEMSIC continues to strengthen supply assurance and sustain reliable deliveries to back WHOOP’s business growth.

During the meeting, the MEMSIC team presented the company’s history and product portfolio via English videos and product roadmaps. Huang Haiyan remarked: “Although our partnership with WHOOP spans only three years, our business has grown alongside WHOOP’s rising shipments, which is truly encouraging. MEMSIC is doing its utmost to guarantee product supply.”

This collaboration is built upon more than two decades of MEMSIC’s technological and industrial foundation. Founded in 1999 and listed on NASDAQ in 2007, MEMSIC has developed a rich product lineup covering motion sensing, magnetic sensing and mixed-signal solutions. Entering a new growth phase, MEMSIC has advanced strategic, organizational and product restructuring, aiming to deliver stronger customer support through a more focused product portfolio and streamlined collaboration framework.

Building on current achievements, MEMSIC looks forward to expanding cooperation with WHOOP. Huang Haiyan proposed that WHOOP further evaluate MEMSIC’s IMU products and share test results with MEMSIC’s technical team. Real feedback from end applications will help MEMSIC refine IMU performance, better tailor products for wearable devices and pave the way for future design-ins.

Before the meeting concluded, Huang Haiyan warmly invited the WHOOP team to tour MEMSIC’s Wuxi factory at their convenience to learn more about MEMSIC’s R&D, manufacturing capabilities and product offerings. The discussion wrapped up in an open and cordial atmosphere.

Steady Progress: Unlocking Automotive Electronics Collaboration with Gentex

The delegation then traveled to Michigan to visit Gentex. A leading player in automotive rearview mirrors, Gentex has long collaborated with MEMSIC and is steadily increasing its adoption of MEMSIC high-precision geomagnetic sensors.

“We have worked with Gentex for a long time and our business keeps growing, which proves we have built a solid foundation for cooperation,” Huang Haiyan stated. She expressed gratitude for Gentex’s long-standing support and voiced hopes for more product evaluations and design-in opportunities based on existing collaboration.

As vehicles grow more intelligent, requirements for sensing motion status, position and angle data become more diverse, pushing sensor adoption into additional niche automotive scenarios. Against this backdrop, the two sides discussed new products and development directions including automotive-grade IMUs, automotive-grade magnetic encoders, inductive angle sensors and 3D linear automotive Hall sensors, and explored the application potential of MEMSIC devices in automotive electronics.

From the widely deployed high-precision geomagnetic sensors to next-generation candidates such as IMUs, magnetic encoders and Hall sensors, MEMSIC offers an expanded product suite to address evolving sensing demands in automotive electronics. Huang Haiyan also invited relevant Gentex teams to visit MEMSIC’s Wuxi factory at an appropriate time. Deeper technical and manufacturing exchanges will help turn potential collaborative projects into reality.

Customer-Centric Innovation: Building Products for Real-World Needs

This U.S. trip connected smart wearable projects in Boston and automotive electronics initiatives in Michigan. Across different use cases, the core objective remains the same: driving product innovation from customer requirements and fostering shared growth through long-term partnerships.

For sensor companies, getting a chip designed into end products depends not only on performance specifications, but also on technical validation, application adaptation and continuous iteration. When customers raise new requirements, MEMSIC goes beyond simple product introductions. It actively pursues evaluation opportunities, collects technical feedback and invites customers to tour manufacturing sites, creating a tight feedback loop between product roadmaps and market demands.

Moving forward, MEMSIC will leverage its strengths in motion sensing, magnetic sensing and mixed-signal technology to deepen communication and collaboration with global customers. The company will advance the adoption of ultra-low-power accelerometers, IMUs, geomagnetic sensors, magnetic encoders and Hall sensors across more wearable and automotive electronics applications. With superior products, stable supply and responsive service, MEMSIC will deliver lasting value to partners. Through innovative smart sensing solutions and expanding global collaboration, MEMSIC will keep contributing its strengths to the development of the wearable and automotive electronics industries.