Jointly Building an IC Innovation Ecosystem | MEMSIC Attends the 2026 Council Meeting of China IC Unicorn Alliance

On the afternoon of September 21, the 2026 Council Meeting of the China IC Unicorn Alliance was held at CEC Southern Software Park in Zhuhai. Lu Jian, CEO of MEMSIC, attended the meeting together with alliance leaders, representatives of council member entities and industry guests. Participants discussed the alliance’s development roadmap and exchanged views on innovation and coordinated growth within the integrated circuit industry.

The integrated circuit industry is a strategic, fundamental and pioneering sector underpinning high-quality economic and social development in China. As a new round of technological revolution and industrial transformation advances, emerging applications such as artificial intelligence, embodied intelligence, smart vehicles and robots are evolving rapidly, imposing higher requirements for chip innovation, industrial chain collaboration and commercialization of R&D outcomes. Pooling superior resources, connecting upstream and downstream industrial players, and nurturing innovative enterprises with core competitiveness have become critical tasks for advancing high-quality industrial development.

Founded jointly by well-known IC unicorns together with industry, academia, research institutes, end users and financial investment institutions, the China IC Unicorn Alliance aims to identify domestic integrated circuit enterprises with strong innovation capabilities, rapid growth and leadership potential in niche tracks.

The council held in-depth discussions on the alliance’s progress and medium-term plans. An annual certificate presentation ceremony for council members took place during the session, and a strategic cooperation agreement was signed between Southern Software Park and the China IC Unicorn Alliance. Representatives from member organizations shared insights on industry trends, corporate innovation practices and collaboration needs, aligning consensus and pooling innovation resources to strengthen the IC ecosystem and enable efficient coordination across all industrial links.

As a key player in intelligent sensors, MEMSIC regards technological innovation as its core growth driver. The company continuously focuses on the R&D of high-performance sensor products and technologies, advancing sensing technology upgrades and product innovation for scenarios including smart terminals, automotive electronics, industrial control and robotics.

Faced with new industrial opportunities brought by intelligentization, MEMSIC pursues continuous breakthroughs in its own technical capabilities while actively strengthening collaboration with upstream and downstream partners, research institutions and industry platforms. Through deepened technical exchanges, demand matching and joint innovation, MEMSIC closely integrates R&D with market adoption to accelerate the industrialization of innovative technologies, deliver greater value to customers and fuel the growth of the intelligent sensing industry.

MEMSIC’s participation in this council meeting marks an important step for the company to embed itself into the IC innovation ecosystem and deepen industrial collaboration. Going forward, MEMSIC will stay innovation-driven, leveraging its core intelligent sensor technologies and mass-production capabilities. Together with alliance members and industrial partners, MEMSIC will promote deep integration of innovation, industrial, capital and talent chains, build an open, collaborative and mutually beneficial industrial ecosystem, and contribute MEMSIC’s strengths to the high-quality development of China’s integrated circuit industry.