Exclusive Interview with MEMSIC Global CTO ② | Three Core Capabilities Underpin MEMSIC’s Competitive Edge

Against the backdrop of AI rapidly reshaping end-user applications, competition among sensor vendors is shifting from comparisons of standalone product specifications toward an integrated contest covering design expertise, mass-production experience and technology models. In an exclusive interview with Jiwei Network, Stephen, Global CTO of MEMSIC, stated that MEMSIC’s competitive strengths stem primarily from its chip design capabilities, industry expertise and unique Fab-Lite business model.

video link：https://weixin.qq.com/sph/AHVcoxqgP

Stephen notes that to build highly optimized sensor products, companies need end-to-end know-how spanning product definition, sensor architecture design, ASIC development, test methodology and quality control. They must also accumulate profound experience in high-volume manufacturing and adopt a flexible, efficient technical model to focus core resources on key segments.

Jiwei Network: In the AI era, what do you regard as MEMSIC’s core competitiveness? How does MEMSIC maintain sustainable competitive advantages in the global marketplace?

Stephen: I believe our competitive advantages lie in both chip design capabilities and industry experience, which can be broken down into three dimensions.

First is our design capability. Backed by an experienced technical team, we possess full-spectrum expertise covering everything from initial product definition, sensor architecture design and ASIC development, to the entire chain of test methodology and quality control.

All of this is critical. You need a big-picture vision to enable close collaboration between sensor and ASIC developers, together with system-level specialists, so as to refine highly optimized products.

The second dimension is our experience in high-volume manufacturing. MEMSIC has shipped more than 4.5 billion chips cumulatively. This demonstrates our deep-rooted track record in delivering high-quality products in massive volumes.

This represents undeniable hard power within the semiconductor industry. The capability for large-scale, high-quality delivery becomes especially vital as a company expands its market share.

The third dimension is our technological advantage embodied by our Fab-Lite model. Under this model, we operate our own fab with core AMR wafer fabrication technology, while outsourcing general-purpose ASIC wafer manufacturing. This allows us to concentrate resources on breakthroughs in core technologies.