Technology

The advances in Micro Electro Mechanical Systems (MEMS) technology has enabled motion detection or inertial sensors, known as accelerometers, to be implemented in many applications for various industries. The micrometer-sized sensors measure motion such as acceleration, vibration, shock, tilt, and inclination. Accelerometers were traditionally based on capacitive or piezoresistive technology that measures the movement of a micro-mechanical mass structure. Such technology possesses inherent issues such as surface adhesion, known as stiction, hysteresis, mechanical ringing, electromagnetic interference (EMI), expensive custom fabrication process, and other challenges associated with micro-mechanical moving structures. In order to resolve these issues, MEMSIC has developed a disruptively different technology that addresses the challenges typically associated with traditional MEMS based accelerometers. Based on a patented unique thermal technology, MEMSIC is the world's first company to offer thermally based MEMS inertial sensor with mixed signal processing circuitry on a single chip using standard CMOS process.

The unique single silicon chip design approach fundamentally reduces cost and enhances the chip's performance, functionality and quality beyond what is possible with other technologies.

The principal of operation of MEMSIC devices is based on heat transfer by natural convection.

The devices measure internal changes in heat transfer caused by acceleration, offering significant advantages over the use of a traditional solid proof-mass structure. Since the proof mass in the MEMSIC sensor design is gas molecules, movable mechanical structures are eliminated within the accelerometer. The result is the ability for a MEMSIC accelerometer to withstand a theoretical shock limit over 50,000g, which is over 5X that of traditional accelerometers, and also to eliminate the problems associated with the surface adhesion known as stiction.

In addition, special handling and testing that add significant OEM costs are no longer required. MEMSIC's standard CMOS compatible process along with its high quality manufacturing capability allows MEMSIC to consistently produce the highest quality accelerometers with failure rates up to several thousand times better than that of traditional MEMS based accelerometers. Such technology and manufacturing ability fundamentally eliminates the unacceptable failure rates and production costs associated with other accelerometer technologies, and positions MEMSIC as the perfect solution for consumer applications, where high shock environments are common and high failure rates are not accepted. This mix of high quality and value opens up a world of new features for consumer products not previously possible with traditional MEMS accelerometers.





Temperature sensors equidistant from the heater measure the same temperature until device is accelerated as shown in top picture. Acceleration of the sensor creates a non-symmetrical temperature profile from which acceleration is detected as shown in the lower picture.