Employment Opportunities

MEMSIC is a fast growing company and is constantly investing in itself to expand the product lines into multiple technologies and market segments. We are looking for many senior and talented candidates to join our friendly and dynamic team in both Boston and Wuxi to develop the world's most advanced technologies and products. We offer a US competitive compensation package for positions in both Boston and Wuxi, China. All positions require strong team leadership, creativity and innovation.

To apply or learn more about our employment opportunities, contact HR@MEMSIC.com

Openings currently available are:

Senior Packaging Engineer

This position will lead our team of engineers to develop the state-of-the-art micro-chip packaging, flip chip packaging, wafer-level packaging and micro-module assembly technologies and processes. MSEE or PhD. in physics or Material Sciences with 10+ years of experiences in micro-packaging and flip chip development and engineering are needed. Position open in Wuxi, China.

Sr. Leader in Process Engineering

This position will lead our team of engineers to develop the state-of-the-art MEMS process and front-end wafer level packaging processes. PhD in Physics or Electrical Engineering with 10+ years of experiences in semiconductor process development and product engineering are required. Position open in Wuxi, China.