MEMS-Based System Solutions: Packaging

The packaging for a MEMS device is a critical component element
of delivering a successful MEMS-based system solution (MBSS) to
the market as stated in a previous article [1]. Roger Grace
Associates’ (RGA) research has found that in typical current
MEMS-based products, the packaging cost can be from 20% to
40% of the total material and assembly cost of the product.
Testing after packaging is much more costly than testing at the
device level because of yield factors. In order to achieve the
optimum solution from a yield and cost perspective, testing
needs to be conducted at several points of the production
process starting with mechanical and electrical testing at the
wafer level even before the chip is placed in a package.

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Memsic in publications
Memsic in publications